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Microelectromechanical system packaging and their applications in the field of micro-enhanced sensing is discussed in this chapter. In this chapter, we discuss the latest advancement in wafer bonding techniques in microelectromechanical systems packaging and their applications. High-density assembly technologies have become one of the most important research areas in three-dimensional integration, with rapid advancement of device miniaturization.
Source link: https://doi.org/10.1007/978-3-030-79749-2_7
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