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Micro nanofluidics - Springer Nature

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Last Updated: 08 February 2022

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Evolution of Wafer Bonding Technology and Applications from Wafer-Level Packaging to Micro/Nanofluidics-Enhanced Sensing

Microelectromechanical system packaging and their applications in the field of micro-enhanced sensing is discussed in this chapter. In this chapter, we discuss the latest advancement in wafer bonding techniques in microelectromechanical systems packaging and their applications. High-density assembly technologies have become one of the most important research areas in three-dimensional integration, with rapid advancement of device miniaturization.

Source link: https://doi.org/10.1007/978-3-030-79749-2_7

* Please keep in mind that all text is summarized by machine, we do not bear any responsibility, and you should always check original source before taking any actions

* Please keep in mind that all text is summarized by machine, we do not bear any responsibility, and you should always check original source before taking any actions