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Cavity lasers - Springer Nature

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Last Updated: 02 November 2021

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Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements

Integrating semiconductor optical amplifiers on direct-bandgap III-- V substratums with low-loss silicon or silicon-nitride photonic incorporated circuits has been key to chip-scale external-cavity lasers that provide wideband tunability along with small optical linewidths. Photonic cable bonds can be written in-situ in a fully automated process with forms adapted to the mode-field sizes and the settings of the chips at both ends, therefore supplying low-loss coupling also in visibility of limited positioning accuracy. In a proof-of-concept experiment, we utilize an InP-based reflective SOA in addition to a silicon photonic outside feedback circuit and show a single-mode tuning variety from 1515 to 1565 nm in addition to side setting suppression ratios above 40 dB and inherent linewidths to 105 kHz. Our method combines the scalability benefits of monolithic combination with the efficiency and flexibility of hybrid multi-chip assemblies and might thus open a course in the direction of integrated ECL on a variety of assimilation platforms.

Source link: https://doi.org/10.1038/s41598-021-95981-w

* Please keep in mind that all text is summarized by machine, we do not bear any responsibility, and you should always check original source before taking any actions

* Please keep in mind that all text is summarized by machine, we do not bear any responsibility, and you should always check original source before taking any actions