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Since it is the primary 2D encapsulation material, the manufacture of high-quality hexagonal boron nitride is essential for the ultimate success of two-dimensional materials-based devices. Although the annealing temperature is above Tp in the case of carbon-free conditions, the h-BN disintegrates and nitrogen desorbs from the surface more effectively than boron, resulting in clean metal surfaces. However, in the high-temperature zone, graphene forms on Pt as the h-BN layer is exposed to carbon.
Source link: https://arxiv.org/abs/2210.07020v1
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