CDS - Arxiv

Post-deposition annealing and interfacial ALD buffer layers of Sb$_2$Se$_3$/CdS stacks for reduced interface recombination and increased open-circuit voltages

The open circuit voltage, which is the subject of this investigation, is the main bottleneck for further device enhancement when assembled into a device stack.

Source link: https://arxiv.org/abs/2204.13138v1

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